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[Case Study] Automatic Packaging Equipment for Plastic Cases for Semiconductor Factories

A case where the horizontal handling of heavy objects has been eliminated, reducing the burden on workers and alleviating concerns about product damage!

We would like to introduce a case study of the "Automatic Packaging System for Plastic Cases for Semiconductor Factories." The goal was to automate the packaging of FOSBs, addressing issues such as "the heavy load on workers due to the weight of the items" and "the risk of product damage if not handled carefully." Our solution involved automatically inserting plastic cases into aluminum laminated bags, followed by vacuum sealing, lamination processing, label issuance, label application, and packaging using anti-static polyethylene bags. Improvements included a reduction in defective vacuum packaging of aluminum laminated bags and a decrease in labeling errors with barcode labels. *For more details, please refer to the PDF document or feel free to contact us.*

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• Binding/Packing Machine